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3-D Data Storage, Power Delivery, and RF/Optical Transceiver—Case Studies of 3-D Integration From System Design Perspectives

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5 Author(s)
Tong Zhang ; Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY ; Micheloni, R. ; Guoyan Zhang ; Zhaoran Rena Huang
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Three-dimensional (3-D) integration of systems by vertically stacking and interconnecting multiple materials, technologies, and functional components offers a wide range of benefits, including speed, bandwidth and density increase, power reduction, small form factor, packaging reduction, yield and reliability increase, flexible heterogeneous integration with multifunctionality, and overall cost reduction. A new spectrum of opportunities and challenges arises for integrated system designers, which warrants rethinking and innovations from system design perspectives. By selecting three representative cases, i.e., solid-state data storage, power delivery, and hybrid radio-frequency/optical transceiver for distributed sensor networks, this paper intends to exemplify the potentials of exploiting the benefits of 3-D integration technology from system perspectives.

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Proceedings of the IEEE  (Volume:97 ,  Issue: 1 )