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Stackable memory of 3D chip integration for mobile applications

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7 Author(s)
Gu, S.Q. ; Adv. Technol. Integration, Qualcomm Inc., San Diego, CA ; Marchal, P. ; Facchini, M. ; Wang, F.
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Stacking memory with 3D chip integration technology could provide the much needed bandwidth and memory density for mobile applications at low power. The contribution of this paper is to review the desired attributes of a stackable memory from system aspects and discuss its implementation challenges.

Published in:

Electron Devices Meeting, 2008. IEDM 2008. IEEE International

Date of Conference:

15-17 Dec. 2008