Cart (Loading....) | Create Account
Close category search window

3-D Stacked Package Technology and Trends

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Carson, F.P. ; STATS ChipPAC, Inc., Fremont, CA ; Young Cheol Kim ; In Sang Yoon

The need to integrate more device technology in a given board space for handheld applications such as mobile phones has driven the adoption of innovative packages which stack such devices in the vertical or third dimension (3D). Stacking of device chips in small and thin fine-pitch ball grid array packages has evolved into the stacking of packages themselves to achieve the same end. The advantage of stacking packages rather than device chips is that packages can be fully tested good prior to stacking. There are two primary ways to stack packages to achieve such vertical integration: package-on-package (PoP) and package-in-package (PiP). Innovative variations of PoP and PiP are being developed to address specific packaging needs and market trends. This paper will detail some of the key technology supporting PoP and PiP packages currently in production and the development of new variations of such packages to address future trends.

Published in:

Proceedings of the IEEE  (Volume:97 ,  Issue: 1 )

Date of Publication:

Jan. 2009

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.