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Superresolved Imaging of Microelectronic Devices for Improved Failure Analysis

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3 Author(s)
Gur, E. ; Shenkar Coll. of Eng. & Design, Ramat-Gan ; Weizman, Y. ; Zalevsky, Z.

In this paper, we present a new numerical approach for improving the resolving power of low-resolution (LR) images. This approach may be applied for failure analysis of microelectronic chips. The resolution improvement is based upon numerical iterative comparison between a LR experimentally captured image and a high-resolution layout image of the same region of interest.

Published in:

Device and Materials Reliability, IEEE Transactions on  (Volume:9 ,  Issue: 2 )

Date of Publication:

June 2009

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