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Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy

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2 Author(s)
Hsiao, Hsiang-Yao ; Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu ; Chih Chen

In this paper, the temperature distribution during electromigration in flip-chip SnAg3.5 solder bumps is directly examined using infrared microscopy. Two clear hot spots are observed in the bump. One is located at the region with peak current density, and the other one is at the bump edge under the current-feeding metallization on the chip side. Under a current stress of 1.06 times 104 A/cm2, the temperature in the two hot spots are 161.7degC and 167.8degC, respectively, which surpass the average bump temperature of 150.5degC. In addition, effect of under-bump-metallization (UBM) thickness on the hot spots is also examined. It indicates that the hot-spot temperature in the solder bump increases for the solder joints with a thinner UBM.

Published in:

Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Date of Conference:

22-24 Oct. 2008