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Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging

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6 Author(s)
Chengkuo Lee ; Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore ; Daquan Yu ; Aibin Yu ; Liling Yan
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In this paper, we proposed new intermediate bonding layers (IBLs) of Ag-rich composition in In-Ag solder systems in contrast to previous studies mainly based on eutectic composition. The intermetallic compounds (IMCs) at the bonding interface were investigated with respect to the bonding condition, post-bonding room temperature storage and post-bonding heat treatment. The IMCs of Ag2In and Ag9In4 with high temperature resist to post-bonding process are derived under process condition of wafer bonding at 180degC, 40 mins and subsequent 120degC~130degC annealing for 24 hours. Based on our results, we can design proper packaging process flow so as to get reliable wafer level packaged MEMS devices.

Published in:
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Date of Conference: 22-24 Oct. 2008

Page(s):
216 - 219
E-ISBN :
978-1-4244-3621-7
Print ISBN:
978-1-4244-3620-0
INSPEC Accession Number:
10474209
Conference Location :
Taipei
Digital Object Identifier :
10.1109/EMAP.2008.4784267
Product Type:
Conference Publications

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