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TSV/3D-TSV Package materials solution from DuPont Electronic Technologies

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1 Author(s)
Itabashi, T. ; DuPont Electron. Technol., DuPont Electron. Center, Kawasaki

There is a consistence flux of miniaturization, value added functionality to IC packaging/ modules driven by significant increase of mobile/networking products in the consumer market. The advanced packaging technologies, particularly TSV/3D-TSV approach is driving innovative design and novel applications. This paper is examine IC packaging roadmap, product portfolio from DuPont Electronic technologies, including dryfilms, cleaning agents, CMP slurries, permanent coatings and adhesives. Also examine idea of applications and example of performance data specifically focus on TSV/3D-TSV technology and process.

Published in:

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Date of Conference:

22-24 Oct. 2008

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