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Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis

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5 Author(s)
Chan-Yen Chou ; Adv. Packaging Res. Center, Nat. Tsing Hua Univ., Hsinchu ; Tuan-Yu Hung ; Sano, M. ; Shin-Yueh Yang
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In this research, LS-DYNA dynamic simulation is conducted to study the responses of board-level drop test based on JESD22-B111 regulation. In this part, two phases of simulations were performed. First, the drop table and test board together with a strike surface and rigid base are considered. The effects of strike surface and screw, used to fix test board on the drop table, are investigated. Second, the PCB model was simulated by input-G method, and the dynamic responses in frequency domain were analyzed. Besides, the drop test experiment was performed in this study. The measured acceleration and strain at the center of PCB were analyzed by fast Fourier transformation (FFT). Finally, the modal analysis of printed circuit board (PCB) was performed and validated with experimental data. Results showed that the PCB revealed first mode vibration after the drop impact loading. All studies including LS-DYNA simulation, modal analysis, and FFT analysis, represented similar first vibrational frequency. Moreover, factors which may affect the dynamic response of PCB and chip are discussed in this research.

Published in:

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Date of Conference:

22-24 Oct. 2008