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Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Developed by Diffusion Couples

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4 Author(s)
Ping-Feng Yang ; Central Labs, Advanced Semiconductor Engineering, Inc., Kaohsiung 811, Taiwan, R.O.C., Department of Engineering Science, National Cheng Kung University, Tainan 701, Taiwan, R.O.C ; Sheng-Rui Jian ; Yi-Shao Lai ; Rong-Sheng Chen

Nanotribological characteristics, including coefficient of friction, wear coefficient, and wear resistance, of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds developed by annealing Sn-Cu or Sn-Ni diffusion couples were investigated in this work. The scratch test conditions combine a constant normal load of 10, 20, or 30 mN and a scratch rate of 0.1 1, or 10 mum/s. Experimental results indicate that as the normal load increases, the pile-up heightens and the scratch deepens, leading to greater coefficient of friction and wear coefficient while smaller wear resistance. Moreover, the scratch rate does not have a significant effect on the nanotribological characteristics except for Cu6Sn5 and Cu3Sn under a normal load of 10 mN. Though hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4 is similar, Ni3Sn4 appears to be more prone to wear damage.

Published in:

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference

Date of Conference:

22-24 Oct. 2008