By Topic

Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Developed by Diffusion Couples

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Ping-Feng Yang ; Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung ; Sheng-Rui Jian ; Yi-Shao Lai ; Rong-Sheng Chen

Nanotribological characteristics, including coefficient of friction, wear coefficient, and wear resistance, of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds developed by annealing Sn-Cu or Sn-Ni diffusion couples were investigated in this work. The scratch test conditions combine a constant normal load of 10, 20, or 30 mN and a scratch rate of 0.1 1, or 10 mum/s. Experimental results indicate that as the normal load increases, the pile-up heightens and the scratch deepens, leading to greater coefficient of friction and wear coefficient while smaller wear resistance. Moreover, the scratch rate does not have a significant effect on the nanotribological characteristics except for Cu6Sn5 and Cu3Sn under a normal load of 10 mN. Though hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4 is similar, Ni3Sn4 appears to be more prone to wear damage.

Published in:

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Date of Conference:

22-24 Oct. 2008