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The following topics are dealt with: advanced packaging; ASE industry technologies including solder joints, substrate pad metallization and finish, drop impact reliability and failure mechanism, reflow process, mechanical properties of intermetallic compounds, BGA design, and wafer level test; HDI and embedded technology including flexible electronics circuits and modules, Via2-laser embedded technology, microvia filling, and plating; green packaging including wave soldering, lead-free array package reworking; ball grid array packages, halogen-free solder paste, and lead-free soldering; advanced micro-system such as MEMS-based devices; Nan Ya PCB and CCL industrial technologies including wire bonding; flip chip CSP substrate, chip scale packages, and materials for packaging; quality and reliability of solder interconnects, TFBGA package, package on package, panel base package (PBTM); bending and fatigue life tests; green PCB, PCBA, materials, and assembly; DuPont electronics technology including PWB, wafer level packaging, and materials for TSV process; SPIL industry; modeling and simulation of materials and structures for flip chip packaging, wire bonding, and bump design; ITRI 3D technology including 3D interconnection technology, 3D stacked die packages, and system in package; and PTH and metal finishing including plating and dry films.

Published in:

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Date of Conference:

22-24 Oct. 2008