In this paper, we report a simple, innovative, fast, accurate, and nondestructive technique for extracting two critical device parameters-multiplication layer thickness xd and integrated areal charge density σactive in separate absorption, grading, charge, and multiplication (SAGCM) InP/InGaAs avalanche photodiodes (APDs), using punchthrough and breakdown voltages obtained from dc photocurrent measurements, We consider in detail the systematic uncertainties due both to the neglect of ionization in the absorption and charge layers, and to different ionization rates in InP reported in the literature. We also consider random errors caused by uncertainties from experiments and other device parameters, The combined error for x d is <0.05 μm, and for σactive is <3%, and these errors are smaller than errors associated with xd and σactive determined using current techniques of secondary ion mass spectroscopy (SIMS) and Hall analysis, which are destructive and/or require separate calibration wafers
Published in:
Electron Devices, IEEE Transactions on
(Volume:42
,
Issue:
12
)
Date of Publication: Dec 1995