Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

Design of a head-tape interface for ultra low flying

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Yiqian Wu ; Center for Magnetic Recording Res., California Univ., San Diego, La Jolla, CA, USA ; Talke, F.E.

A novel tape head contour is proposed that allows very small head tape spacing at high velocities using three transverse bleed slots and a single radius cylindrical head. A finite element based numerical model is used to determine the head-tape spacing as a function of physical design parameters including tape roughness, tape speed and tape tension. The Greenwood-Williamson theory of contact between rough surfaces is applied to account for asperity contacts as the head-tape spacing decreases below the peak-to-valley surface roughness. The sensitivity of the new head design on geometrical parameters is studied and the variation of spacing and contact pressure is determined as a function of physical and geometrical design parameters. The numerical results are compared with interferometric measurements of the head-tape spacing using head contours based on our numerical design. Excellent agreement is found between numerical predictions and experimental measurements and it is concluded that the spacing at the head-tape interface is limited by surface roughness

Published in:

Magnetics, IEEE Transactions on  (Volume:32 ,  Issue: 1 )