By Topic

Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Rooks, S.M. ; Dept. of Mech. Eng., Toronto Univ., Ont., Canada ; Benhabib, B. ; Smith, K.C.

An inspection process based on scanned-beam X-ray laminography (SBXLAM) is proposed herein for quantitatively monitoring the quality of ball-grid-array (BGA) joints. The long-term reliability of the BGA joints depends on the component-assembly process producing joints with sufficient solder volume and proper alignment. Inspection algorithms were developed to measure the critical BGA-joint characteristics, including the alignment between the ball and the PCB pad, the solder thickness, and the average joint-diameter, and thus, determine whether the joints are defective. The performance of the inspection algorithms was evaluated by inspecting samples with defects that were independently verified

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )