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Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip

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4 Author(s)
Vader, D.T. ; Dept. of Eng., Messiah Coll., Grantham, PA, USA ; Chrysler, G.M. ; Chu, R.C. ; Simons, R.E.

A technique was developed to facilitate subcooled pool boiling and jet impingement boiling of liquid nitrogen at the surface of a silicon chip by varying the dewar pressure while maintaining the bath temperature constant at about 78 K. Subcooling levels of up to 10 K could be easily reached by pressurizing the liquid nitrogen bath with helium gas. Convective and boiling impingement cooling of up to 80 W/cm 3 from a silicon chip has been measured for a submerged subcooled liquid nitrogen jet

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Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )