By Topic

Asymptotic thermal analysis of electronic packages and printed-circuit boards

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Da-Guang Liu ; Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada ; Phanilatha, V. ; Qi-Jun Zhang ; Nakhla, M.S.

The electric thermal network analogy method is widely used to study thermal behavior of electronic components. This analogy usually leads to a large resistance-capacitance (RC) network. Conventional simulation techniques of these networks require substantial computational resources. This paper presents a new solution technique based on a recently developed asymptotic waveform evaluation (AWE) concept which has been successfully used for transient simulation of large electrical networks. Application of AWE to time dependent thermal analysis of printed circuit boards often results in two orders of magnitude speed-up over current iterative techniques, yet retaining comparable accuracy

Published in:

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:18 ,  Issue: 4 )