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A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials

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5 Author(s)
L. Kehoe ; Nat. Microelectron. Res. Centre, Cork, Ireland ; P. V. Kelly ; G. M. O'Connor ; M. O'Reilly
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Alumina derivative ceramics and low temperature co-fired ceramic (LTCC) electronic multichip module (MCM) packaging substrates have been characterized using single- and double-sided inspection laser flash thermal diffusivity measurement techniques. The paper highlights problems associated with both the measurement system and associated data analysis for the single-sided measurement, and these data are evaluated with reference to that measured by an existing (double sided inspection) standard laser flash method. Finally, a preliminary single-sided measurement methodology is proposed.

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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A  (Volume:18 ,  Issue: 4 )