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Utilizing a low cost 3D packaging technology for consumer applications

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4 Author(s)
S. P. Larcombe ; Dept. of Electron. & Electr. Eng., Sheffield Univ., UK ; J. M. Stern ; P. A. Ivey ; L. Seed

This paper demonstrates how a low cost three-dimensional packaging (multichip module-vertical) technology can be utilized to implement systems for consumer applications. In any application where system cost, volume and mass are important, this packaging technique can be advantageous, particularly in the rapidly growing portable electronics industry. To illustrate this we present a general-purpose, low-cost camera and image processing system in the new packaging technology. This can be used in multimedia, surveillance and smart vision applications

Published in:

IEEE Transactions on Consumer Electronics  (Volume:41 ,  Issue: 4 )