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Package Design Optimization for Electrical Performance of a Power Module using Finite Element Analysis

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3 Author(s)
Erwin, I.V.A. ; Adv. Package Technol. Group, Fairchild Semicond., Cebu, Philippines ; Seung-Han Paek ; Taek-Keun Lee

This paper presents the development of a high power module package having improved its electrical performance optimizing the package structure and the circuit layout on a substrate throughout Finite Element Analysis (FEA). The result of FEA shows that the modeling is finely calibrated from the verification, that is, comparing it with actual measurement values of several types of design configuration. This module package is used for synchronous rectification and contains MOSFETs, resistors and a driver IC. High electrical current over as much as 100A should flow through the devices, interconnect materials, traces and the Cu leads of the package. In order to decrease the on-state resistance or RDS(ON), the package design needs to be investigated to find ways of improving the high electrical resistance paths such as the interconnect wires and traces. The authors initially worked on a simple 3D Finite Element Model using a commercial Finite Element Analysis (FEA) software ANSYS® and correlated the results with an actual experiment. After establishing the model, a variety of bonding configurations of Aluminum wire bonding and Cu clip bonding are investigated to achieve the optimum RDS(ON), and modifying the design of the leadframe is also studied. Aside from improving the electrical resistance, it is also necessary that the circuit will have a comparable RDS(ON) value so that the thermal effects of the individual devices would be similar.

Published in:

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Date of Conference:

9-12 Dec. 2008