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Fluidic Interconnects in Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

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8 Author(s)
Tang Gong Yue ; Institute of Microelectronics, A STAR (Agency for Science, Technology and Research), 11 Science Park Road, Science Park II, Singapore 117585; Email: tanggy@ime.a-star.edu.sg ; Tan Siow Pin ; Navas Khan ; D. Pinjala
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In this paper, an integrated liquid cooling system for 3D stacked modules with high power dissipation is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop has been designed and fabricated, and the compact system is integrated. In line with the fluidic interconnect design and analysis, an experimental setup for hydraulic characterization of the integrated cooling system is established. The pressure drop for different fluidic interconnects in this system have been measured and compared with the analyzed results.

Published in:

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Date of Conference:

9-12 Dec. 2008