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3D integration technologies using through-Si via (TSV) technologies are receiving increased interest. A wide diversity of technologies is being proposed and an increasing number of potential application areas are identified. Different application domains have different TSV requirements and justify different integration approaches. The most important challenges to a widespread use of 3D integration technologies are related to the economics of the 3D TSV and stacking processes, the availability of suitable equipment for large scale production and the possible negative impact on the device quality and reliability of the TSV processing.