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Solving Technical and Economical Barriers to the Adoption of Through-Si-Via 3D Integration Technologies

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1 Author(s)
Eric Beyne ; IMEC, Kapeldreef 75, 3001 Leuven, Belgium,

3D integration technologies using through-Si via (TSV) technologies are receiving increased interest. A wide diversity of technologies is being proposed and an increasing number of potential application areas are identified. Different application domains have different TSV requirements and justify different integration approaches. The most important challenges to a widespread use of 3D integration technologies are related to the economics of the 3D TSV and stacking processes, the availability of suitable equipment for large scale production and the possible negative impact on the device quality and reliability of the TSV processing.

Published in:

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Date of Conference:

9-12 Dec. 2008