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Trends of Power Electronic Packaging and Modeling

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4 Author(s)
Yong Liu ; Fairchild Semiconductor Corp., South Portland, ME 04074, Email:; Tel: (207)761-3155 Fax: (207)761-6339 ; Scott Irving ; Timwah Luk ; Dan Kinzer

A review of recent advances in power electronic packaging is presented based on the development of power device integration. The presentation will cover in more detail how advances in both semiconductor content and power advanced package design and materials have co-enabled significant advances in power device capability during recent years. Extrapolating the same trends in representative areas for the remainder of the decade serves to highlight where further improvement in materials and techniques can drive continued enhancements in usability, efficiency, reliability and overall cost of power semiconductor solutions. Along with new power packaging development, the role of modeling is key to assure successful package design. An overview of the power package modeling is presented. Challenges of power semiconductor packaging and modeling in both next generation design and assembly processes are presented and discussed.

Published in:

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Date of Conference:

9-12 Dec. 2008