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In this paper, design and modeling of different types of micromachined patch antennas are described. After initial design, these antenna geometries are optimized using commercial software tools and then fabricated on high resistivity silicon wafers. To start with, a thin dielectric film of silicon nitride or silicon dioxide is deposited on silicon substrates by radio frequency (RF) sputtering. After patterning the antenna conductor on top of the dielectric film, the dielectric membrane is released using bulk-micromachining technique. These antennas are then assembled on a special test jig with K-connectors and tested for their performance characteristics. The measured characteristics of a millimeter wave micromachined circular patch antenna realized on 270 mum thick silicon substrate.