Referenced Items are not available for this document.
TiNi shape memory alloy in thin film form is an excellent candidate for MEMS microactuation. Using RF sputter deposition, thin films of TiNi (51.7 at% Ti-48.3 at% Ni) have been formed on silicon substrates and produced shape memory behavior at approximately 60°C. Films were amorphous when deposited and were subsequently annealed at 515°C for 30 min. to crystallize the shape memory microstructure. Excellent adherence was achieved onto silicon, SiO2 and poly-silicon surfaces. Microfabrication was used to create TiNi diaphragms, which exhibited useful shape memory microactuation and other desirable mechanical properties. The diaphragms recovered greater than 2% strain when heated through the phase transformation temperature, providing a maximum work density of at least 5×106 J/m 3. This work density is higher than that of any other type of microactuation
Published in:
Microelectromechanical Systems, Journal of
(Volume:4
,
Issue:
4
)
Date of Publication: Dec 1995
- Page(s):
- 206 - 212
- ISSN :
- 1057-7157
- INSPEC Accession Number:
- 5167887
- Digital Object Identifier :
- 10.1109/84.475547
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Dec 1995
- Sponsored by :
- IEEE Electron Devices Society
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
