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Demonstration of three-dimensional microstructure self-assembly

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3 Author(s)
Green, P.W. ; Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK ; Syms, R.R.A. ; Yeatman, E.M.

Self-assembly of three-dimensional microstructures using the surface tension force of molten solder to produce out-of-plane rotation is demonstrated. The generic nature of the technique is illustrated by reconfiguring structures formed in both Ni metal and single crystal Si. The structures do not have a hinge to constrain the rotation. This considerably simplifies fabrication and eliminates problems associated with the compatibility of a suitable hinge material. Details of the fabrication processes are given and results are presented for rotated structures

Published in:

Microelectromechanical Systems, Journal of  (Volume:4 ,  Issue: 4 )