By Topic

A novel type of low dielectric and heat-resistant resin for printed wiring boards

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Nawa, K. ; Sumitomo Metal Ind. R&D Center, Hyogo, Japan ; Ohkita, M.

We developed a novel type of low dielectric and heat-resistant resin. The resin was synthesized from dehydrating reaction between fused aromatics and 1,4-benzenedimethanol, therefore, it was called advanced polyCOndensed fused PolyNuclear Aromatic Resin (advanced COPNA-Resin). The advanced COPNA-Resin exhibited characteristic properties for an electrical insulator: e.g., high Tg (250°C), low dielectric constant (3.1 for 1 MHz), and low water absorption (0.37 wt.%). We studied fabrication and properties of prepregs, double-sided copper-clad laminates, printed wiring boards with copper-plated through-holes using advanced COPNA-Resin as an insulating material. Prepregs were fabricated by the dipping process of E-glass or T-glass fiber woven fabrics into the resin solution. Copper-clad laminates were obtained by hot-press fabrication of advanced COPNA-Resin prepregs. The laminates reinforced by E-glass fiber woven fabric exhibited characteristic properties for multilaying printed wiring boards. Tg was 255°C. The dielectric constant was 4.2. Advanced COPNA-Resin laminates exhibited higher Tg and lower dielectric constant than polyimide laminates known as heat-resistant and low dielectric materials. The linear thermal expansion coefficient of advanced COPNA-Resin laminates for xy-axis was 4-5 ppm, and that for z-axis was 29 ppm. Advanced COPNA-Resin printed wiring board exhibited outstanding reliability of electrical connection of copper-plated through-holes in comparison with the epoxy or the polyimide system. From those analysis for Tg, dielectric constant, linear thermal expansion coefficients, and through-hole reliability, the advanced COPNA-Resin was regarded as novel type of advanced material for high-density interconnects such as fine-pitch surface mount and multichip modules

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:18 ,  Issue: 4 )