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Global Digital-Analog Co-Simulation Methodology for Power and Signal Integrity aware Design and Analysis

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2 Author(s)
Wane, S. ; NXP-Semicond., Colombelles ; Boguszewski, G.

In this paper a global co-simulation methodology for concurrent/simultaneous analysis of passive and active analog/digital parts is proposed. An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Dedicated real-world NXP-Philips-Semiconductors active modules mounted on test-board have been designed and measured for validation of the proposed co-simulation methodology. Full-wave electromagnetic modeling, broadband SPICE compact model extractions and measurement results are successfully compared.

Published in:

Microwave Conference, 2008. EuMC 2008. 38th European

Date of Conference:

27-31 Oct. 2008