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In this paper a global co-simulation methodology for concurrent/simultaneous analysis of passive and active analog/digital parts is proposed. An original power-signature concept is introduced to model high-speed digital modules temporal and spatial distribution of their power switching activity through specified chip partitions. Dedicated real-world NXP-Philips-Semiconductors active modules mounted on test-board have been designed and measured for validation of the proposed co-simulation methodology. Full-wave electromagnetic modeling, broadband SPICE compact model extractions and measurement results are successfully compared.