Referenced Items are not available for this document.
The use of vias as interconnection structure in high-density system on package (SoP) substrates and printed circuit boards (PCBs) is the most common solution to route signals in multilayer structures. However this configuration poses a problem in term of simultaneous swithching noise (SSN) producing false switching in digital circuits and malfunctioning in analog circuits. The purpose of this work is to present a novel planar electromagnetic bandgap (EBG) structure which is able to overcome this drawback within a large bandwidth (1.0 GHz - 6.6 GHz) with a good suppression level (less than -30 dB) and also along a wide range of directions.
Published in:
Microwave Conference, 2008. EuMC 2008. 38th European
Date of Conference: 27-31 Oct. 2008
- Page(s):
- 1374 - 1377
- Print ISBN:
- 978-2-87487-006-4
- INSPEC Accession Number:
- 10400433
- Conference Location :
- Amsterdam
- Digital Object Identifier :
- 10.1109/EUMC.2008.4751720
- Product Type:
- Conference Publications
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