A comparison of power module transistor stacks

This work presents an analysis of the effects of substrate and baseplate thermal conductivity on thermal resistance for three power module technologies: direct bond copper (DBC); thick film printed substrate; and insulated metal substrate (IMS). The effects of fatigue induced solder voiding and thermal grease conductivity on thermal resistance are presented for DBC. Accurate modelling of the case-to-sink thermal grease interface is included. The effects of fatigue induced solder voiding are presented for DBC.<
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