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A comparison of power module transistor stacks

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3 Author(s)
Van Godbold, C. ; Dept. of Electr. Eng., South Carolina Univ., Columbia, SC, USA ; Anand Sankaran, V. ; Hudgins, J.L.

This work presents an analysis of the effects of substrate and baseplate thermal conductivity on thermal resistance for three power module technologies: direct bond copper (DBC); thick film printed substrate; and insulated metal substrate (IMS). The effects of fatigue induced solder voiding and thermal grease conductivity on thermal resistance are presented for DBC. Accurate modelling of the case-to-sink thermal grease interface is included. The effects of fatigue induced solder voiding are presented for DBC

Published in:

Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE  (Volume:1 )

Date of Conference:

18-22 Jun 1995