Cart (Loading....) | Create Account
Close category search window

Design Optimization of Needle Geometry for Wafer-Level Probing Test

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Meng-Kai Shih ; Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan ; Yi-Shao Lai

The probing test is a typical quality control method for individual chips on a wafer. With a proper design, the service life of probing needles in the probe card can be sufficiently elongated and hence reduces the testing cost. In this paper, we followed the Taguchi method with the L18(21 times 37) orthogonal array to obtain an optimal geometrical design of the probing needle based on the minimization of the scrub length the probe tip travels during a wafer-level probing test procedure. Geometrical factors of the needle included tip shape, needle diameter, beam length, taper length, knee diameter, shooting angle, tip length, and tip diameter. Importance of theses factors on the scrub length was also ranked.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:32 ,  Issue: 2 )

Date of Publication:

June 2009

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.