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Co-Optimization of signal, power, and thermal distribution networks for 3D ICs

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2 Author(s)
Young-Joon Lee ; Electrical And Computer Engineering, Georgia Institute of Technology, 777 Atlantic Drive NW, Atlanta GA 30332, U.S.A. ; Sung Kyu Lim

Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solution to dramatically reduce the operating temperature of 3D ICs. In addition, designers use a highly complex hierarchical power distribution network in conjunction with decoupling capacitors to deliver currents. However, these thermal and power/ground interconnects together with those used for signal delivery compete with each other for routing resources including various types of Through-Silicon-Vias (TSVs). This paper presents the first work on routing with these multi-functional interconnects in 3D: signal, thermal, and power distribution networks. We demonstrate how to consider various physical, electrical, and thermo-mechanical requirements of these multi-functional interconnects to successfully complete routing while addressing various reliability concerns.

Published in:

2008 Electrical Design of Advanced Packaging and Systems Symposium

Date of Conference:

10-12 Dec. 2008