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Liquid crystal polymer (LCP) has been used as an RF substrate material for the packaging. As the technology continues to improve, LCP does not satisfy all of the thickness requirements for mobile applications. Therefore, a new dielectric material (Material-A) has been developed, which can be extremely thin and has a lower processing temperature than LCP. To accurately extract Material-A properties, we present a new extraction method which has a major advantage over the previously published techniques especially for low dielectric and low loss dielectrics. In this paper, the new method has been applied for extracting the frequency-dependent dielectric constant and loss tangent up to 40 GHz for Material-A, and a Debye model that satisfies the causality has been developed.