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Single wafer all-wet photo resist strip process for LDD implant in CMOS technology

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8 Author(s)

This paper reports the comparison between conventional ash followed by wet bench process approach and the new all wet process for LDD implant application. The comparison covers the areas of defect performance, (material loss, electrical data, yield) and chemical consumption.

Published in:
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Date of Conference: 20-23 Oct. 2008

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