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Enhancement of endurance for CuxO based RRAM cell

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8 Author(s)
Yin, M. ; Sch. of Microelectron. & State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China ; Zhou, P. ; Lv, H.B. ; Tang, T.A.
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For the first time, we report that the copper oxide (CuxO) based resistive random access memory (RRAM) cell can achieve 104 cycles (i.e. ~10x better) as a new record as well as elimination of the initial ¿forming¿ than reported in literature. The copper oxide is integrated in MIM (metal-insulator-metal) structure and is grown by plasma oxidation of Cu substrate, with CuO near upper surface and graded CuxO (i.e. increasingly Cu rich or O-vacancies rich) toward the Cu substrate. A thinner CuO upper layer can eliminate ¿forming¿ process and, for in turn, greatly enhance the endurance of resistive switching by eliminating the damage during the ¿forming¿ process.

Published in:

Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Date of Conference:

20-23 Oct. 2008

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