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Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly

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4 Author(s)
Tong Hong Wang ; Adv. Semicond. Eng., Central Labs., Kaohsiung ; Yi-Shao Lai ; Chang-Chi Lee ; Yu-Cheng Lin

In this paper, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined. The numerical analysis shows that coupled power and thermal cycling creates temperature excursions based on the thermal cycling profile. Also, reliability of the PoP is highly related to the range of temperature excursions and the degree of deviation of the temperature profile from the thermal cycling profile.

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:32 ,  Issue: 1 )