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A comparison of stuck-at fault coverage and IDDQ testing on defect levels

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1 Author(s)
P. C. Wiscombe ; VLSI Technol. Inc., San Jose, CA, USA

This paper presents experimental data comparing the effect of functional stuck-at fault testing and IDDQ testing on defect levels. Results obtained for parts tested with varying stuck-at fault coverage are compared with results from IDDQ testing. Empirical data are analyzed against two theoretical fault models to demonstrate that correlation can be obtained. The results indicate that significant benefits can be gained from IDDQ testing, even with non-deterministic test locations and relatively few measurements. Data are also presented on the impact of IDDQ testing on burn-in monitoring and customer field failures of ASIC designs. Finally some practical issues associated with implementing IDDQ tests are discussed

Published in:

Test Conference, 1993. Proceedings., International

Date of Conference:

17-21 Oct 1993