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Wafer Test Methods to Improve Semiconductor Die Reliability

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1 Author(s)
Mann, W.R. ; Rockwell International (Retired)

Incremental advances in semiconductor device testing have improved device quality and reliability. New test methods applied to dies at the wafer level are now significantly improving the reliability of devices sold to the increasing bare-die market and reducing burn-in requirements for packaged devices.

Published in:

Design & Test of Computers, IEEE  (Volume:25 ,  Issue: 6 )