Silicon MEMS tactile imager using flexible deformation of integrated pixel array

In this paper, a novel concept of multi-functional MEMS tactile imager using flexible deformation of silicon IC for advanced tactile sensing applications is presented. Integration design of multi-functional tactile imager with sensing abilities of contact-force, hardness and temperature distributions is totally discussed based on their measured performances. This tactile sensor has a sensing region of silicon diaphragm on which two-dimensional (2-D) sensor array and circuits are integrated. Signal processing circuitry for the sensing array is also integrated around the diaphragm. The sensing diaphragm is pneumatically swollen by an air-pressure to obtain a soft and flexible surface of tactile sensor. Contact force distribution of touching object can be detected from stress distribution on the deformed diaphragm. Also, hardness distribution can be detected by ‘amplitude-modulation’ of the diaphragm vibration. Finally, total device design of multi-functional monolithic tactile imager is discussed.