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This paper presents the design, fabrication, and measured properties of a novel zero-insertion-force (ZIF) micro (mu)-connector. The proposed ZIF mu-connector is shown to remedy a number of problems in the existing microelectromechanical-system-based connectors, such as the wearing effect, the poor signal integrity for high-speed signal transmission, and the lack of latch design. The three-mask and silicon-on-insulator wafers are designed for the simultaneous fabrication of terminals and latches. Prototype connectors are demonstrated with five 1800-mum-long, 100-mum-wide, and 2-mum -high terminals on a 150-mum pitch. The terminals and latches are actuated by electrostatic force to avoid the wearing and kinking during the mating process. The terminal is a multimorph cantilever to form a hooklike out-of-plane shape. The controlled shape of the terminal provides a reliable contact at the interface. The properties of the proposed ZIF mu-connector are measured and analyzed, including the out-of-plane shape of the terminal, driving voltage, dc contact resistance, and the RF characteristics. The potential applications of the ZIF mu-connector include the fine-pitch high-speed interconnection, 3-D reworkable packaging, and the performance enhancement of many existing mu-connectors.