Referenced Items are not available for this document.
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
Published in:
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Date of Conference: 1-4 Sept. 2008
- Page(s):
- 1245 - 1250
- E-ISBN :
- 978-1-4244-2814-4
- Print ISBN:
- 978-1-4244-2813-7
- INSPEC Accession Number:
- 10397647
- Conference Location :
- Greenwich
- Digital Object Identifier :
- 10.1109/ESTC.2008.4684532
- Product Type:
- Conference Publications
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