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Evolution of VLSIs materials and packaging technology correlated with progress of thin films deposition and outlets bonding methods

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3 Author(s)
Emelyanov, V. ; Corp. "Integral", Minsk ; Baranov, V. ; Emelyanov, A.

The main results concerning vacuum deposition of thin films to the silicon wafers and local electrochemical covering to the interconnecting frame have been described in the paper. These methods and technological conditions have been developed in order to meet the requirements of the process of VLSIs packaging into plastic housings.

Published in:

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Date of Conference:

1-4 Sept. 2008

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