By Topic

Evolution of VLSIs materials and packaging technology correlated with progress of thin films deposition and outlets bonding methods

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Emelyanov, V. ; Corp. "Integral", Minsk ; Baranov, V. ; Emelyanov, A.

The main results concerning vacuum deposition of thin films to the silicon wafers and local electrochemical covering to the interconnecting frame have been described in the paper. These methods and technological conditions have been developed in order to meet the requirements of the process of VLSIs packaging into plastic housings.

Published in:

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Date of Conference:

1-4 Sept. 2008