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The present article describes an approach for optimization of thermal performance of 3D micro-components from pin-ring type implemented in IC package to PCB assembly and micro mechanical actuators by common use of DOE and CFD simulations. The goal of the considered approach is to define a real concurrent process for design of reliable microelectronic systems for specific applications. A model, containing all of the requisite design factors such as sizes, material and form was created using the commercially available CFD software, FLOTHERM. The results of simulation of test structures are verified by thermovision measurements by infrared camera P640 of FLIR. Advantages and disadvantages of different studied constructions of micro-contacts are analyzed in respect of better parameters of the process of heat transfer.