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Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes

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6 Author(s)
Seman, A. ; Electron. Manuf. Eng. Res. Group Medway Sch. of Eng., Univ. of Greenwich, Chatham ; Ekere, N.N. ; Ashenden, S.J. ; Mallik, S.
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This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level.

Published in:

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Date of Conference:

1-4 Sept. 2008

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