By Topic

System analysis of wafer logistics information management for IC packaging foundry in Taiwan

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Yu-Chuan Liu ; Dept. of Inf. Manage., Tainan Univ. of Technol., Tainan

The IC manufacturing related business had been remarkably developed for the past decade in Taiwan. In addition to the well-known wafer fabrication industries, the IC design house and IC packaging/testing business together form a contiguous supply chain form material to system in Taiwan. Logistics and information management of the wafer is the key linkage in the wafer foundry process. The objectives of this paper are to firstly review the issues of global wafer logistics from wafer fabrication to IC packaging. Secondly, an operation model for wafer logistics management in IC packaging foundry will be developed. Development of this research is not only essential for the computerization and automation of the wafer warehousing, but also the kernel of the e-business for IC packaging business.

Published in:

Service Operations and Logistics, and Informatics, 2008. IEEE/SOLI 2008. IEEE International Conference on  (Volume:2 )

Date of Conference:

12-15 Oct. 2008