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The IC manufacturing related business had been remarkably developed for the past decade in Taiwan. In addition to the well-known wafer fabrication industries, the IC design house and IC packaging/testing business together form a contiguous supply chain form material to system in Taiwan. Logistics and information management of the wafer is the key linkage in the wafer foundry process. The objectives of this paper are to firstly review the issues of global wafer logistics from wafer fabrication to IC packaging. Secondly, an operation model for wafer logistics management in IC packaging foundry will be developed. Development of this research is not only essential for the computerization and automation of the wafer warehousing, but also the kernel of the e-business for IC packaging business.