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This paper presents a low-loss, substrate-independent approach to integrate transceiver front-ends for 60-GHz wireless applications. Dielectric loss is eliminated by using polymer and bulk silicon micromachining technologies to create a cavity-based duplexer and a horn antenna in the air, above the substrate. A coplanar waveguide input is used for easy integration of the low-noise amplifier and power amplifier of the receiver and transmitter, respectively, with the micromachined passive module. A prototype is designed, fabricated, and characterized, with the transmit band (TX) set between 58.7-59.5 GHz and the receive band (RX) as 60.6-61.4 GHz. The proposed method offers an easy integration of both planar components and 3-D integrated modules on top of the substrate.
Published in:
Microwave Theory and Techniques, IEEE Transactions on
(Volume:56
,
Issue:
12
)
Date of Publication: Dec. 2008
- Page(s):
- 2779 - 2788
- ISSN :
- 0018-9480
- INSPEC Accession Number:
- 10349091
- Digital Object Identifier :
- 10.1109/TMTT.2008.2007358
- Product Type:
- Journals & Magazines
- Date of Publication :
- 18 November 2008
- Date of Current Version :
- 08 December 2008
- Issue Date :
- Dec. 2008
- Sponsored by :
- IEEE Microwave Theory and Techniques Society
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