By Topic

Patterned Floating Dummy Fill for On-Chip Spiral Inductor Considering the Effect of Dummy Fill

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Tsuchiya, A. ; Dept. of Commun. & Comput. Eng., Kyoto Univ., Kyoto ; Onodera, Hidetoshi

This paper discusses the effect of dummy fills on the performance of spiral inductors. In Si-CMOS processes that use copper wire, metal dummy fills are required to prevent thickness fluctuation in the chemical mechanical polishing stage. Dummy fills have been thought to affect the wire capacitance; however, in high frequency, dummy fills also affect the wire resistance and the wire inductance due to the eddy current in dummy fills. This work evaluates the effect of the dummy fills by three-dimensional field solver and proposes a structure to suppress the effect of dummy fills. Experimental results show that the proposed method can decrease the effect of dummy fills on the Q-factor by 83% compared with the conventional dummy fill insertion.

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:56 ,  Issue: 12 )