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This paper presents the modeling of lossy substrate integrated waveguide interconnects and components by using the boundary integral-resonant mode expansion method. The extension of the numerical technique to account for conductor, dielectric and radiation losses is discussed. Moreover, a systematic investigation of the different contributions of loss and their dependence on some geometrical parameters is performed in the case of interconnects and components, aiming at minimizing the losses. The physical explanation of the different effects is also provided. Finally, the validity of the equivalent waveguide concept is extended to the case of lossy interconnects and components.