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A 600-GHz CMOS focal-plane array for terahertz imaging applications

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2 Author(s)
Ullrich R. Pfeiffer ; High-Frequency and Communication Technology, University of Wuppertal, Rainer-Gruenter-Str. 21, D-42119, Germany ; Erik Ojefors

A 600-GHz single-chip focal-plane array (FPA) has been fully integrated in a 0.25-mum CMOS process technology. The 3times5 array achieves a room temperature responsivity of 50 kV/W and a noise equivalent power (NEP) of 400 pW/radicHz. Each pixel comprises of an on-chip antenna, an NMOS incoherent power detection circuit based on resistive self-mixing, and a 43-dB amplifier with a 1.6-MHz bandwidth. The pixel size is 150times150 mum2 and the overall array size is 680times980 mum2 including bondpads. The circuit topology makes it possible to fully integrate terahertz focal-plane arrays for 600-GHz video-rate imaging applications in a low-cost CMOS process technologies for the first time.

Published in:

Solid-State Circuits Conference, 2008. ESSCIRC 2008. 34th European

Date of Conference:

15-19 Sept. 2008