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An industry-oriented curriculum in the design and performance of electrical packaging and interconnect

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3 Author(s)
Evans, R.J. ; SPRTG-High Speed Design Group, Cisco Syst. Inc., Research Triangle Park, NC ; Scearce, S. ; Minjhing Hsieh

The need for education in the performance analysis of electrical package and interconnect is strong in both industrial and academic research environments. While both the industrial and academic environments share much of the same basic theory in this subject, there are two distinct paths for the resulting applications of this knowledge. The industry requirements are detailed, practical skills that can be used immediately, while the education provided by the academic institutions is more focused on basic theory and research skill development. This paper offers a contrast of these approaches, with a more in-depth description of how Cisco systems has developed their own detailed training curriculum in signal integrity engineering.

Published in:

Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP

Date of Conference:

27-29 Oct. 2008

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