By Topic

Thermal Challenges in Next-Generation Electronic Systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

16 Author(s)
Garimella, Suresh V. ; Dept. of Mech. Eng., Purdue Univ., West Lafayette, IN ; Fleischer, A.S. ; Murthy, Jayathi Y. ; Keshavarzi, A.
more authors

Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 4 )